Samsung to use TSMC 3nm process for Nvidia custom HBM chips
- Boom: Samsung will use TSMC's 3nm node for the base die in Nvidia's custom HBM chips
- Doom: Samsung is skipping its own 4nm process, ceding that work to a direct competitor
- Neutral: Nvidia's unified HBM specification is reported to have driven Samsung to use TSMC
- Neutral: This is the first reported instance of Samsung sourcing from TSMC for HBM production
The story in full
Samsung Electronics will use TSMC's 3nm fabrication process to manufacture the base die for Nvidia's next-generation custom high-bandwidth memory chips, according to a report first published by Seoul Economic Daily on October 18, 2026. The arrangement marks the first time Samsung has turned to TSMC for a component in its HBM production, bypassing Samsung's own 4nm node for the base die portion of Nvidia's custom HBM design.
Nvidia has been developing a proprietary HBM specification, referred to in some reports as NVHBM, which requires a logic-class base die built on an advanced process node. Samsung, despite operating its own foundry, is sourcing that specific component from TSMC at Nvidia's direction, combining the two manufacturers in a single supply chain for the same product.
Analysis
398 wordsOn October 18, 2026, Seoul Economic Daily reported that Samsung Electronics will use TSMC's 3nm fabrication process to build the base die for Nvidia's next-generation custom high-bandwidth memory chips, a product referred to in some reports as NVHBM. Samsung is bypassing its own 4nm foundry node for this component, sourcing it from TSMC at Nvidia's direction. The result is a single product that combines manufacturing from two companies that are ordinarily direct competitors.
The significance lies in what the arrangement reveals about where leverage sits in the AI hardware supply chain. Nvidia's custom HBM specification requires a logic-class base die built on an advanced process node, and Samsung's own foundry was apparently not the preferred option for that work. For Samsung, ceding a component to a rival within its own product is an unusual concession. For TSMC, landing base die work inside a Samsung HBM order extends its reach further into memory infrastructure. The arrangement also raises questions about how Nvidia's growing influence over supplier decisions shapes competition between foundries.
The pro-AI camp has posted no reactions to this story yet. Based on typical patterns, that camp would likely frame the development as a sign of healthy industry coordination, with leading companies pooling capabilities to accelerate AI hardware. The anti-AI camp is more vocal, though its concerns reach beyond this specific deal. Frank Frankly raised the tension between official rhetoric about beating China in AI and the continued sale of Nvidia chips to China. Samuel argued that Nvidia has drifted far from its origins, calling for a leaner company focused on consumer graphics rather than what he called AI garbage. Pashha Theosifon pointed to CoreWeave, described as a key part of Nvidia's financing ecosystem, being rated at 64% likelihood of default. Argonian Mage called the RTX 50 Series a waste of money. Dr. Steven Buckley was more terse, simply questioning the stability of the industry as a whole. The one middle-ground voice, Techmeme X Chatter, treated the unusual manufacturing pairing as a natural product of turbulent conditions.
The immediate question is whether Samsung's foundry division can maintain relevance in advanced AI chip components as Nvidia increasingly dictates process requirements. Any announcement from Nvidia clarifying the NVHBM specification, or from Samsung about its own next-generation node progress, would help clarify whether this arrangement is a one-time accommodation or a lasting shift in how AI memory supply chains are structured.
What Anti-AI voices are sayingAlarm camp sees Nvidia as financially unstable and consumer-hostile, pointing to CoreWeave's default risk and circular financing as signs the AI buildout is unsound. Some also criticize Nvidia for serving AI and geopolitical agendas over ordinary GPU buyers.
Quote 1 of 6What Middle Ground voices are sayingThe situation is turbulent but potentially generative of unexpected developments.
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More Anti-AI reactions (5)
“CoreWeave - a lynchpin in the AI buildout and key NVidia circular financing jerk buddy - was rated at 64% likely to default. Here's to hoping the pattern holds.”
𐍉𐌸𐌰 𐌶𐌰𐌺𐌰𐍂𐌹𐌰𐌷 𐌴𐌳𐍅𐌰𐍂𐌳 𐌻𐍉𐌷𐍃𐌴, Bluesky · 20:02 UTC“Trump and Jensen Huang, CEO of Nvidia, keep saying we need to beat China in the AI war. But then Trump allows Nvidia to sell their chips to China.”
Frank Frankly, Bluesky · 21:13 UTC“Yeh, totally stable industry we've got here...”
Dr. Steven Buckley, Bluesky · 20:00 UTC“Wish that the moloch that Nvidia itself has become would go the same way before returning reincarnated as a slimmer, consumer focused designer of *Graphics* processing units, delivering price effective, standards compliant, no-BS cards to humans”
Samuel, Bluesky · 10:19 UTC“US AI model is under test. China AI is cheap cos it isn't borrowing at 15% to buy best chips from shareholder Nvidia (CoreWeave), trucking in gas to start delayed projects (Oracle), planning data centers in Space (SpaceX)”
Sandy Hendry, Bluesky · 06:34 UTC
No more Middle Ground reactions
Sources
14 articles from 13 outlets- Taiwan NewsSamsung to use TSMC process for Nvidia’s next-generation memory chips
- 天下雜誌Samsung to Use TSMC’s 3nm Process for Nvidia’s Next-Generation HBM|Daily News Digest|2026-10-19|web only
- XenoSpectrumSamsung to Use TSMC's 3nm for NVIDIA's NVHBM Base Die, Skipping Its Own 4nm, Report Says
- BigGo FinanceNVIDIA's Unified Spec Forces South Korea's Samsung to Bend, Using TSMC 3nm for HBM Base Die for the First Time
- FirstpostSamsung to use TSMC’s 3nm process for Nvidia’s next-generation HBM chips: Report
- Business StandardSamsung to tap TSMC technology for Nvidia's custom memory chips: Report
- Crypto BriefingTSMC to build base dies for Nvidia’s custom HBM chips
- The Economic TimesSamsung to use TSMC technology for Nvidia's next-generation memory chips: Report
- The Business TimesSamsung to use TSMC tech for Nvidia's next-generation memory chips, says Seoul newspaper
- ReutersSamsung to use TSMC technology for Nvidia's next-generation memory chips, Seoul newspaper reports
- The Edge MalaysiaSamsung to use TSMC technology for Nvidia's next-generation memory chips — report
- WccftechNVIDIA’s Development Of Custom HBM Drops Samsung’s And TSMC’s Foundry Rivalry, As Both Manufacturers Join Forces To Develop “Base Die” On The 3nm Node
- BigGo FinanceSamsung Electronics Taps TSMC's 3nm Process for Nvidia Custom HBM Base Die
- Seoul Economic DailySamsung to Use TSMC for Base Die in Nvidia's Custom HBM
